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Number of process chambers:

Up to 5 process chambers

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Process chamber type:

Sputter & Degas & Pre-clean

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Load-Lock:

2 Separate Load-Lock Chambers

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Transfer chamber:

Integrated BROOKS System

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Ion source:

DC/RF Ion Source

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Pumping system:

Cryopump/Magnetic suspension molecular pump + Dry pump

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Vacuum gauge:

Full range vacuum gauge + Capacitive diaphragm vacuum gauge

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Flow control:

Mass flow controller

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Ultimate vacuum:

1E-5Pa

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Temperature control range:

-50℃ to 500℃

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Uniform deposition area:

?300mm

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Uniform etch area:

?250mm

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Coating/Etch uniformity:

±5%

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Space requirements:

3.73m（Length）*2.75m（Width）*2.2m（Height）